40G QSFP to QSFP Active Direct Attach Copper Twinax Cable (ACC)
Compliant with
40G InfiniBand 8x DDR，4x QDR，10G/40Gigabit Ethernet standard
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| SPECIFICATIONS | |||
|---|---|---|---|
| Cable End Connector A | QSFP+ | Cable End Connector B | QSFP+ |
| Jumper Type | Direct-Attach | Data Rate | 40G |
| Aggregate Bit Rate | 41.2Gbps | Lane Bit Rate | 10.3Gbps |
| Number of Channels | 4 | Single Channel Rate | 10G |
| Minimum Bend Radius | 5X Cable OD -Single, 10X Cable OD - Repeated | Factory Brand | PHILISUN |
| Attenuation | 24AWG:10dB/10m maximum 26AWG:10dB/8.5m maximum 28AWG:10dB/7m maximum 30AWG:8.4dB/5.5m maximum | Bit Error Rate | ≤10-12 |
| Shield | Braid/Foil | Wire AWG | 24AWG/26AWG/28AWG/30AWG |
| Cable Type | Active Twinax | Cable OD | 30AWG: 4.2mm 28AWG: 4.7mm 26AWG: 5.2mm 24AWG: 6.0mm |
| Cable Colour/Material | Black PVC(OFNR) | Cable Length Selection | 1-10 meter |
| Protocols | SFF-8436/QSFP MSA | Application Scenarios | 10/40Gigabit Ethernet (10/40GbE) |
| Supply Voltage | 3.3V | Power Dissipation | <2W |
| Operating Temperature | 0 to 70℃ (32 to 158℉) | Storage Temperature | -40 to 85℃ (-40 to 185℉) |
PRODUCT PRESENTATION
The PHILISUN 40G QSFP+ active copper cable is designed for 40GBASE Ethernet applications, providing a direct QSFP+ to QSFP+ connection solution. It complies with IEEE 802.3ba and QSFP MSA standards. Easy to install, high-speed and cost-effective, this cable is ideal for short‑reach connections within or between adjacent racks in data centers.
DAC SERIES PRODUCTS
PRODUCTION & TESTING EQUIPMENT
PERFORMANCE PARAMETER
| Absolute Maximum Ratings | |||||||||
| Parameter | Symbol | Min | Typ. | Max | Unit | ||||
| Operating Case Temperature | Tc | 0 | – | 70 | ℃ | ||||
| Relative Humidity | RH | – | – | 85 | % | ||||
| Supply Voltage | Vcc | 3.135 | 3.3 | 3.465 | v | ||||
| Total Power Consumption | PD | – | – | 2 | w | ||||
| Data Rate Per Lane | – | 1 | – | 10.3 | Gb/s | ||||
| Note: 1. Damage may occur if the transceiver is subjected to conditions beyond the limits. |
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| Performance Specification | |||||||||
| Electrical | |||||||||
| Min. Dielectric Withstand Voltage | 300 VDC | ||||||||
| Insulation Resistance | 1000 Mohms | ||||||||
| Current Rating | 0.5 Amp Min/Signal Contact | ||||||||
| General | |||||||||
| Operating Temperature | 0 to 70 ℃ | ||||||||
| Flammability Rating(Plastics) | UL 94 | ||||||||
| Green Features | RoHS, Lead-Free | ||||||||
| Shield | Braid/Foil | ||||||||
| Marking | Mfg Name, Part#, Date Code | ||||||||
| Plug | |||||||||
| Backshell Material | Nickel-Plated Zinc Diecast | ||||||||
| Contact Material | PCB with Gold-Plated Pads | ||||||||
| Plastic Material | PA66 | ||||||||
| Latch | Positive Latching w/Pull Tab | ||||||||
| Insertion Force | 40N Max | ||||||||
| Withdrawal Force | 30N Max | ||||||||
| Retention Force | 90N Max | ||||||||
| Durability | 50 Cycles | ||||||||
| Cable | |||||||||
| Conductor | Solid | ||||||||
| Wire Gauge | AWG30, AWG28, AWG26, AWG24 | ||||||||
| Impedance | 100± 5 ohms | ||||||||
| Construction | Twinaxial | ||||||||
| Cable OD | AWG 30 :4.2mm | ||||||||
| AWG 28 :4.7mm | |||||||||
| AWG 26:5.2mm | |||||||||
| AWG 24: 6.0mm | |||||||||
| Jacket Type | PVC | ||||||||
| Bend Radius | 5X Cable OD -Single 10X Cable OD -Repeated |
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| Electrical Characteristics | |||||||||
| Test Type | Test Item | 24AWG | 26AWG | 28AWG | 30AWG | ||||
| Electrical Character istics |
Differential impedance |
100±5Ω @ TDR | 100±5Ω | 100±5Ω | 100±5Ω @ TDR | ||||
| – | Mutual capacitance | 14pF/ft nominal | 14pF/ft nominal | 14pF/ft nominal | 14pF/ft nominal | ||||
| – | Time delay | 1.31ns/ft nominal, (4.3ns/m) nominal |
1.35ns/ft nominal | 1.35ns/ft nominal | 1.35ns/ft nominal, (4.3ns/m) nominal |
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| – | Time delay skew (within pairs) |
80ps/10m maximum | 120ps/8.5m maximum | 120ps/7m maximum | 50ps/5.5m maximum | ||||
| – | Time delay skew (between pairs) |
350ps/ 10m maximum | 500ps/8.5m maximum | 500ps/7m maximum | 350ps/5.5m maximum | ||||
| – | Attenuation | 10dB/ 10m maximum @1.25Ghz |
10dB/8.5m maximum @1.25Ghz |
10dB/7mmaximum @1.25Ghz |
8.4dB/5.5m maximum @ 1.25Ghz |
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| – | Conductor DC Resistance |
0.026Ω /ft maximum @20 ℃ |
0.04Ω /ft maximum @ 20 ℃ |
0.06Ω /ft maximum @20 ℃ |
0.01Ω /ft maximum @20 ℃ |
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| Physical Characteris tics |
Conductors (two pair) |
24AWG Solid, Silver plated copper |
26AWG Solid, Silver plated copper |
28AWG Solid, Silver plated copper |
30AWG Solid, Silver plated copper |
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| – | Insulation | Foam polyolefin | Foam polyolefin | Foam polyolefin | Foam polyolefin | ||||
| – | Pair drain wire |
26AWG Solid, Silver plated copper |
28AWG Solid, Silver plated copper |
30AWG Solid, Silver plated copper |
30AWG Solid, Silver plated copper |
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| – | Overall cable shield |
Aluminum/polyester tape, 125% coverage, Tin plated copper braid,38AWG, 85% coverage |
Aluminum/polyester tape, 125% coverage, Tin plated copper braid,38AWG, 85% coverage |
Aluminum/polyester tape, 125% coverage, Tin plated copper braid,38AWG, 85% coverage |
Aluminum/polyester tape, 125% coverage, Tin plated copper braid,38AWG, 85% coverage |
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| – | Outer diameter |
6.0mm | 5.2mm | 4.7mm | 4.2mm | ||||
Pin Designation
| Pin | Logic | Symbol | Name/Description | Notes | |||||
| 1 | – | GND | Ground | 1 | |||||
| 2 | CML-I | Tx2n | Transmitter Inverted Data Input | – | |||||
| 3 | CML-I | Tx2p | Transmitter Non-inverted Data Input | – | |||||
| 4 | – | GND | Ground | 1 | |||||
| 5 | CML-I | Tx4n | Transmitter Inverted Data Input | – | |||||
| 6 | CML-I | Tx4p | Transmitter Non-inverted Data Input | – | |||||
| 7 | – | GND | Ground | 1 | |||||
| 8 | LVTTL-I | ModSelL | Module Select | – | |||||
| 9 | LVTTL-I | ResetL | Module Reset | – | |||||
| 10 | – | Vcc Rx | +3.3V Power Supply Receiver | – | |||||
| 11 | LVCMOS-I/O | SCL | 2-Wire Serial Interface Clock | 2 | |||||
| 12 | LVCMOS-I/O | SDA | 2-Wire Serial Interface Data | 2 | |||||
| 13 | – | GND | Ground | 1 | |||||
| 14 | CML-O | Rx3p | Receiver Non-Inverted Data Output | – | |||||
| 15 | CML-O | Rx3n | Receiver Inverted Data Output | – | |||||
| 16 | – | GND | Ground | 1 | |||||
| 17 | CML-O | Rx1p | Receiver Non-Inverted Data Output | – | |||||
| 18 | CML-O | Rx1n | Receiver Inverted Data Output | – | |||||
| 19 | – | GND | Ground | 1 | |||||
| 20 | – | GND | Ground | 1 | |||||
| 21 | CML-O | Rx2n | Receiver Inverted Data Output | – | |||||
| 22 | CML-O | Rx2p | Receiver Non-Inverted Data Output | – | |||||
| 21 | CML-O | Rx2n | Receiver Inverted Data Output | – | |||||
| 22 | CML-O | Rx2p | Receiver Non-Inverted Data Output | – | |||||
| 23 | – | GND | Ground | 1 | |||||
| 24 | CML-O | Rx4n | Receiver Inverted Data Output | – | |||||
| 25 | CML-O | Rx4p | Receiver Non-Inverted Data Output | – | |||||
| 26 | – | GND | Ground | 1 | |||||
| 27 | LVTTL-O | ModPrsL | Module Present | 2 | |||||
| 28 | LVTTL-O | IntL | Interrupt | 2 | |||||
| 29 | – | Vcc Tx | +3.3V Power Supply Transmitter | – | |||||
| 30 | – | Vcc1 | +3.3V Power Supply | – | |||||
| 31 | LVTTL-I | LPMode | Low Power Mode | – | |||||
| 32 | – | GND | Ground | 1 | |||||
| 33 | CML-I | Tx3p | Transmitter Non-inverted Data Input | – | |||||
| 34 | CML-I | Tx3n | Transmitter Inverted Data Input | – | |||||
| 35 | – | GND | Ground | 1 | |||||
| 36 | CML-I | Tx1p | Transmitter Non-inverted Data Input | – | |||||
| 37 | CML-I | Tx1n | Transmitter Inverted Data Input | – | |||||
| 38 | – | GND | Ground | 1 | |||||
| Notes: 1. Module ground pins GND are isolated from the module case and chassis ground within the module. 2. Shall be pulled up with 4.7K-10Kohms to a voltage between 3. 14V and 3.47V on the host board. |
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