56G QSFP+ to QSFP+ Passive DAC

SPECIFICATIONS
Cable End Connector A	QSFP+	Cable End Connector B	QSFP+
Jumper Type	Direct-Attach	Data Rate	56G
Aggregate Bit Rate	56Gbps	Lane Bit Rate	16Gbps
Number of Channels	4	Single Channel Rate	16G
Minimum Bend Radius	5X Cable OD -Single, 10X Cable OD - Repeated	Factory Brand	PHILISUN
Attenuation	26AWG:10dB/8.5m maximum 30AWG:8.4dB/5.5m maximum	Bit Error Rate	≤10-12
Shield	Braid/Foil	Wire AWG	26AWG/30AWG
Cable Type	Passive Twinax	Cable OD	30AWG: 6.0mm 26AWG: 7.8mm
Cable Colour/Material	Black PVC(OFNR)	Cable Length Selection	0.5-5 meter
Protocols	SFF-8436/40G InfiniBand 4x FDR/IEEE802.3ba	Application Scenarios	56Gigabit Ethernet (56GbE)
Supply Voltage	3.3V	Power Dissipation	<0.5W
Operating Temperature	0 to 70℃ (32 to 158℉)	Storage Temperature	-40 to 85℃ (-40 to 185℉)

PRODUCT PRESENTATION

The PHILISUN 56G QSFP+ to QSFP+ Passive Direct Attach Copper Twinax Cable (DAC) provides a reliable, high-speed, point-to-point link, optimized for InfiniBand (FDR) and 56GbE protocols in Data Center and HPC environments. Engineered for the lowest power consumption and Ultra-Low Latency, this Passive Copper solution is fully compliant with the IEEE802.3ba and SFF-8436 MSA Standard. It is a Cost-Effective copper twinax alternative, supporting critical links from Switch to Switch and accelerating data transfer for Switch to GPU interconnects over short distances.

DAC SERIES PRODUCTS

PRODUCTION & TESTING EQUIPMENT

QSFP 56g DAC aoc production and testing equipment

PERFORMANCE PARAMETER

Absolute Maximum Ratings
Parameter	Symbol	Min	Typ.	Max	Unit	Ref.
Storage Temperature	Ts	-40	–	85	℃	–
Supply Voltage	VCCT, R	-0.5	–	4	V	–
Relative Humidity	Vcc	0	–	85	%	–

Recommended Operating Environment
Parameter	Symbol	Min	Typ.	Max	Unit	Ref.
Caseoperating Temperature	Tc	0	–	70	℃	–
Supply Voltage	VCCT, R	3.13	3.3	3.47	V	–
Power Dissipation	PD	–	–	0.02	W	–

Pin Assignment

Direct attach cable pin definition diagram

PIN	Logic	Symbol	Description	Notes
1	–	GND	Ground	1
2	CML-I	Tx2n	Transmitter Inverted Data Input	–
3	CML-I	Tx2p	Transmitter Non-Inverted Data Input	–
4	–	GND	Ground	1
5	CML-I	Tx4n	Transmitter Inverted Data Input	–
6	CML-I	Tx4p	Transmitter Non-Inverted Data Input	–
7	–	GND	Ground	1
8	LVTTL-I	ModSelL	Module Select	–
9	LVTTL-I	ResetL	Module Reset	–
10	–	VccRx	+3.3 V Power Supply Receiver	2
11	LVCMOS-I/O	SCL	2-wire serial interface clock	–
12	LVCMOS-I/O	SDA	2-wire serial interface data	–
13	–	GND	Ground	1
14	CML-O	Rx3p	Receiver Non-Inverted Data Output	–
15	CML-O	Rx3n	Receiver Inverted Data Output	–
16	–	GND	Ground	1
17	CML-O	Rx1p	Receiver Non-Inverted Data Output	–
18	CML-O	Rx1n	Receiver Inverted Data Output	–
19	–	GND	Ground	1
20	–	GND	Ground	1
21	CML-O	Rx2n	Receiver Inverted Data Output	–
22	CML-O	Rx2p	Receiver Non-Inverted Data Output	–
23	–	GND	Ground	1
24	CML-O	Rx4n	Receiver Inverted Data Output	–
25	CML-O	Rx4p	Receiver Non-Inverted Data Output	–
26	–	GND	Ground	1
27	LVTTL-O	ModPrsL	Module Present	–
28	LVTTL-O	IntL	Interrupt	–
29	–	VccTx	+3.3V Power supply transmitter	2
30	–	Vcc1	+3.3V Power supply	2
31	LVTTL-I	LPMode	Low Power Mode	–
32	–	GND	Ground	1
33	CML-I	Tx3p	Transmitter Non-Inverted Data Input	–
34	CML-I	Tx3n	Transmitter Non-Inverted Data Output	–
35	–	GND	Ground	1
36	CML-I	Tx1p	Transmitter Inverted Data Output	–
37	CML-I	Tx1n	Transmitter Non-Inverted Data Output	–
38	–	GND	Ground	1
Notes: 1. GND is the symbol for signal and supply (power) common for the QSFP+ module. All are common within the QSFP+ module and all module voltages are referenced to this potential unless otherwise noted. Connect these directly to the host board signal-common ground plane. 2.Vcc Rx, Vcc1 and VccTx are the receiver and transmitter power supplies and shall be applied concurrently. Vcc Rx Vcc1 and VccTx may be internally connected with- in the QSFP+ Module module in any combination. The connector pins are each rated for a maximum current of 500 mA.

PRODUCT CERTIFICATION

COMPATIBLE BRANDS

Compatible optical transceiver brands graphic

CONFIGURATION INFORMATION