40G QSFP+ to 4×10G SFP+ Passive Direct Attach Copper Twinax Cable (DAC)

Compliant with SFF-8436、SFF-8431、SFP+ and QSFP MSA standard
Switch to Switch
Switch to GPU

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SPECIFICATIONS
Cable End Connector AQSFP+Cable End Connector B4×SFP+
Jumper TypeDirect-AttachData Rate40G
Aggregate Bit Rate41.2GbpsLane Bit Rate10.3Gbps
Number of Channels4Single Channel Rate10G
Minimum Bend Radius5X Cable OD -Single, 10X Cable OD - RepeatedFactory BrandPHILISUN
Attenuation24AWG:10dB/10m maximum
26AWG:10dB/8.5m maximum
28AWG:10dB/7m maximum
30AWG:8.4dB/5.5m maximum		Bit Error Rate≤10-12
ShieldBraid/FoilWire AWG24AWG/26AWG/28AWG/30AWG
Cable TypePassive TwinaxCable OD30AWG: 4.2mm
28AWG: 4.7mm
26AWG: 5.2mm
24AWG: 6.0mm
Cable Colour/MaterialBlack PVC(OFNR)Cable Length Selection0.5-10 meter
ProtocolsSFF-8436/SFF-8431/QSFP+ MSA
InfiniBand4x SDR, DDR, QDR		Application Scenarios40Gigabit Ethernet (40GbE)
Supply Voltage3.3VPower Dissipation<0.5W
Operating Temperature0 to 70℃ (32 to 158℉)Storage Temperature-40 to 85℃ (-40 to 185℉)

 

PRODUCT PRESENTATION
The PHILISUN 40G QSFP+ to 4x10G SFP+ Passive Direct Attach Copper Cable (DAC) is a critical breakout cable, converting a single 40G QSFP+ port into four independent 10G SFP+ links. It complies with SFF-8436, SFF-8431, and the SFP+ and QSFP MSA standard. This copper twinax solution is ideal for high-density environments, supporting essential links from Switch to Switch and facilitating connections from Switch to GPU to multiple lower-speed devices.

 

DAC SERIES PRODUCTS

 

PRODUCTION & TESTING EQUIPMENT

 

PERFORMANCE PARAMETER
Absolute Maximum Ratings
Parameter Symbol Min Typ. Max Unit
Operating Case Temperature Tc 0 – 70 ℃
Relative Humidity RS – – 85 %
Supply Voltage VCC3 3.135 3.3 3.465 v
Power Dissipation PD – 1.5 1.5 W
Note:
1. Damage may occur if the transceiver is subjected to conditions beyond the limits.

 

Performance Specification
Electrical
Min. Dielectric Withstand Voltage 300 VDC
Insulation Resistance 1000 Mohms
Current Rating 0.5 Amp Min/Signal Contact
General
Operating Temperature 0 to 70℃
Flammability Rating (Plastics) UL 94
Green Features RoHS, Lead-Free
Shield Braid/Foil
Marking Mfg Name, Part#, Date Code
Plug
Backshell Material Nickel-Plated Zinc Diecast
Contact Material PCB with Gold-Plated Pads
Latch Positive Latching w/Pull Tab
Insertion Force QSFP+: 40N Max. SFP+ 30N Max
Withdrawal Force QSFP+: 30N Max. SFP+ 20N Max
Retention Force 90N Min
Durability QSFP+: 250 Cycles Min. SFP+ 50 cycles Min.
Cable
Conductor Solid
Wire Gauge AWG30/AWG26/AWG24
Impedence 100± 5 ohms
Construction Twin-axial
Cable OD AWG 30 : 4.2mm
AWG 26 : 5.2mm
AWG 24 : 6.0mm
Jacket Type PVC
Bend Radius 5X Cable OD -Single, 10X Cable OD – Repeated

 

Electrical Characteristics
Test Type Test Item 24AWG 26AWG 28AWG 30AWG
Electrical
Characteristics		 Differential
impedance		 100±5Ω @ TDR 100±5Ω 100±5Ω 100±5Ω @ TDR
Mutual capacitance 14pF/ft nomina 14pF/ft nominal l 14pF/ft nominal l 14pF/ft nominal
Time delay 1.31ns/ft nominal, (4.3ns/m) nominal 1.35ns/ft nominal 1.35ns/ft nominal 1.35ns/ft nominal, (4.3ns/m) nominal
Time delay skew (within pairs) 80ps/10m maximum 120ps/8.5m maximum 120ps/7m maximum 50ps/5.5m
maximum
Time delay skew
(between pairs)		 350ps/10m
maximum		 500ps/8.5m maximum 500ps/7m maximum 350ps/5.5m
maximum
Attenuation 10dB/10m maximum
@ 1.25Ghz		 10dB/8.5m maximum
@ 1.25Ghz		 10dB/7m maximum
@ 1.25Ghz		 8.4dB/5.5m
maximum @
1.25Ghz
Conductor DC Resistance 0.026Ω/ft maximum
@20°C		 0.04Ω/ft maximum
@20°C		 0.06Ω/ft maximum
@20°C		 0.01Ω/ft maximum
@20°C
Conductors(two pair) 24AWG Solid, Silver plated copper 26AWG Solid, Silver plated copper 28AWG Solid, Silver plated copper 30AWG Solid, Silver plated copper
Insulation Foam polyolefin Foam polyolefin Foam polyolefin Foam polyolefin
Physical
Characteristics		 Pair drain wire 26AWG Solid, Silver plated copper 28AWG Solid, Silver plated copper 30AWG Solid, Silver plated copper 30AWG Solid, Silver plated copper
Overall cable shield Aluminum/polyester tape, 125% coverage, Tin plated copper braid, 38AWG, 85%
coverage		 r tape, 125% coverage, Tin plated copper braid, 38AWG, 85%
coverage Aluminum/polyester tape, 125% coverage, Tin plated copper braid, 38AWG, 85%
coverage		 Aluminum/polyester tape, 125% coverage, Tin plated copper braid, 38AWG, 85%
coverage		 Aluminum/polyeste
r tape, 125%
coverage, Tin plated
copper braid, 38AWG, 85%
coverage
Outer diameter 6.0mm 5.2mm 4.7mm 4.2mm

 

Pin Definition

 

Pin Logic Symbol Name/Description Notes
1 – GND Module Ground 1
2 CML-I Tx2n Transmitter Inverted Data Input –
3 CML-I Tx2p Transmitter Non-Inverted Data Input –
4 – GND Module Ground 1
5 CML-I Tx4n Transmitter Inverted Data Input –
6 CML-I Tx4p Transmitter Non-Inverted Data Input –
7 – GND Module Ground 1
8 LVTTL-I ModSelL Module Select 2
9 LVTTL-I ResetL Module Reset 2
10 – Vcc Rx +3.3 V Receiver Power Supply –
11 LVCMOS-I SCL 2-wire Serial Interface Clock 2
12 LVCMOS-I/O SDA 2-wire Serial Interface Data 2
13 – GND Module Ground 1
14 CML-O Rx3p Receiver Non-Inverted Data Output –
15 CML-O Rx3n Receiver Inverted Data Output –
16 – GND Module Ground 1
17 CML-O Rx1p Receiver Non-Inverted Data Output –
18 CML-O Rx1n Receiver Inverted Data Output –
19 – GND Module Ground 1
20 – GND Module Ground 1
21 CML-O Rx2n Receiver Inverted Data Output –
22 CML-O Rx2p Receiver Non-Inverted Data Output –
23 – GND Module Ground 1
24 CML-O Rx4n Receiver Inverted Data Output –
25 CML-O Rx4p Receiver Non-Inverted Data Output –
26 – GND Module Ground 1
27 LVTTL-O ModPrsL Module Present, internal pulled down to GND –
28 LVTTL-O IntL Interrupt output, should be pulled up on host board 2
29 – Vcc Tx +3.3 V Transmitter Power supply –
30 – Vcc 1 +3.3 V Power Supply –
31 LVTTL-I LPMode Low Power Mode 2
32 – GND Module Ground 1
33 CML-I Tx3p Transmitter Non-Inverted Data Input –
34 CML-I Tx3n Transmitter Inverted Data Input –
35 – GND Module Ground 1
36 CML-I Tx1p Transmitter Non-Inverted Data Input –
37 CML-I Tx1n Transmitter Inverted Data Input –
36 Tx1p – Transmitter Inverted Data Input –
37 Tx1n – Transmitter Non-Inverted Data Output –
38 – GND Module Ground 1
Notes:
1. GND is the symbol for signal and supply (power) common for the QSFP+ module.  All are common within the QSFP+ module and all module voltages are referenced to this potential unless otherwise noted. Connect these directly to the host board signal-common ground plane.
2. Vcc Rx, Vcc1 and Vcc Tx are the receiver and transmitter power supplies and shall be applied concurrently. Recommended host board power supply filtering is shown below. Vcc Rx, Vcc1 and Vcc Tx may be internally connected within the QSFP+ Module module in any combination. The connector pins are each rated for a  maximum current of 500 mA.

 

SFP+ Pin Descriptions
Pin Logic Symbol Name/Description Notes
1 – VeeT Transmitter Ground –
2 LV-TTL-O TX-Fault N/A 1
3 LV-TTL-I TX-DIS Transmitter Disable 2
4 LV-TTL-O SDA Tow Wire Serial Data –
5 LV-TTL-I SCL Tow Wire Serial Clock –
6 – MOD-DEF0 Module present, connect to VeeT –
7 LV-TTL-I RS0 N/A 1
8 LV-TTL-O ROS LOS of Signal 2
9 LV-TTL-I RS1 N/A 1
10 – VeeR Receiver Ground –
11 – VeeR Receiver Ground –
12 CML-O RD- Receiver Data Inverted –
13 CML-O RD+ Receiver Data Non-Inverted –
14 – VeeR Receiver Ground –
15 – VccR Receiver Supply 3.3 V –
16 – VccT Transmitter Supply 3.3 V –
17 – VeeT Transmitter Ground –
18 CML-I TD+ Transmitter Data Non-Inverted –
19 CML-I TD- Transmitter Data Inverted –
20 – VeeT Transmitter Ground –
Notes:
1.Signals not supported in SFP+ Copper pulled-down to VeeT with 30K ohms resistor.
2.Passive cable assemblies do not support LOS and TX_DIS.

 

PRODUCT CERTIFICATION

 

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CONFIGURATION INFORMATION
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