40G QSFP+ to QSFP+ Passive Direct Attach Copper Twinax Cable (DAC)
Compliant with IEEE 802.3ba、QSFP MSA standard
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| SPECIFICATIONS | |||
|---|---|---|---|
| Cable End Connector A | QSFP+ | Cable End Connector B | QSFP+ |
| Jumper Type | Direct-Attach | Data Rate | 40G |
| Aggregate Bit Rate | 41.2Gbps | Lane Bit Rate | 10.3Gbps |
| Number of Channels | 4 | Single Channel Rate | 10G |
| Minimum Bend Radius | 5X Cable OD -Single, 10X Cable OD - Repeated | Factory Brand | PHILISUN |
| Attenuation | 24AWG:10dB/10m maximum 26AWG:10dB/8.5m maximum 28AWG:10dB/7m maximum 30AWG:8.4dB/5.5m maximum | Bit Error Rate | ≤10-12 |
| Shield | Braid/Foil | Wire AWG | 24AWG/26AWG/28AWG/30AWG |
| Cable Type | Passive Twinax | Cable OD | 30AWG: 4.2mm 28AWG: 4.7mm 26AWG: 5.2mm 24AWG: 6.0mm |
| Cable Colour/Material | Black PVC(OFNR) | Cable Length Selection | 0.5-10 meter |
| Protocols | SFF-8436/QSFP MSA/IEEE 802.3ba | Application Scenarios | 40Gigabit Ethernet (40GbE) |
| Supply Voltage | 3.3V | Power Dissipation | <2W |
| Operating Temperature | 0 to 70℃ (32 to 158℉) | Storage Temperature | -40 to 85℃ (-40 to 185℉) |
PRODUCT PRESENTATION
The PHILISUN 40G QSFP+ to QSFP+ Passive Direct Attach Copper Cable (DAC) delivers reliable, short-reach 40 Gigabit Ethernet connectivity for spine-leaf architectures. It is compliant with the IEEE 802.3ba and QSFP MSA standard. Utilizing passive copper twinax technology, this DAC offers excellent reliability and low power consumption, serving as an economical solution for links from Switch to Switch and providing high-throughput access from Switch to GPU within server racks.
DAC SERIES PRODUCTS
PRODUCTION & TESTING EQUIPMENT
PERFORMANCE PARAMETER
| Absolute Maximum Ratings | |||||||||
| Parameter | Symbol | Min. | Typ. | Max. | Unit | ||||
| Operating Case Temperature | Tc | 0 | – | 70 | ℃ | ||||
| Relative Humidity | RH | – | – | 85 | % | ||||
| Supply Voltage | VCC3 | -0.3 | 3.3 | 3.6 | v | ||||
| Data Rate Per Lane | – | 1 | – | 10.3 | Gb/s | ||||
| Performance Specification | |||||||||
| Electrical | |||||||||
| Signaling Speed per Lane | Signaling Speed per Lane | ||||||||
| Min. Dielectric Withstand Voltage | 300 VDC | ||||||||
| Insulation Resistance | 1000 Mohms | ||||||||
| Current Rating | 0.5 Amp Min/Signal Contact | ||||||||
| General | |||||||||
| Operating Temperature | 0 to 70℃ | ||||||||
| Insulation Resistance | UL 94 | ||||||||
| Green Features | RoHS, Lead-Free | ||||||||
| Shield | Braid/Foil | ||||||||
| Marking | Mfg Name, Part#, Date Code+ | ||||||||
| Plug | |||||||||
| Backshell Material | Nickel Plated Zinc Diecast | ||||||||
| Contact Material | PCB with Gold-Plated Pads | ||||||||
| Plastic Material | PA66 | ||||||||
| Latch | Positive Latching w/Pull Tab | ||||||||
| Insertion Force | 40N Max. | ||||||||
| Withdrawal Force | 30N Max. | ||||||||
| Retention Force | 90N Min. | ||||||||
| Durability | 50 Cycles | ||||||||
| Cable | |||||||||
| Conductor | Solid | ||||||||
| Wire Gauge | AWG30, AWG28, AWG26, AWG24 | ||||||||
| Impedence | 100 +/-5 ohms | ||||||||
| Construction | Twinaxial | ||||||||
| Cable OD | AWG 30 : 4.2mm | ||||||||
| AWG 28 : 4.7mm | |||||||||
| AWG 26 : 5.2mm | |||||||||
| AWG 24 : 6.0mm | |||||||||
| Jacket Type | PVC | ||||||||
| Bend Radius | 5X Cable OD -Single | ||||||||
| 10X Cable OD -Repeated | |||||||||
| Electrical Characteristics | |||||||||
| Test Type | Test Item | 24AWG | 26AWG | 28AWG | 30AWG | ||||
| Electrical Characteristics |
Differential impedance |
100±5Ω @ TDR | 100±5Ω | 100±5Ω | 100±5Ω @TDR | ||||
| Mutual capacitance | 14pF/ft nominal | 14pF/ft nominal | 14pF/ft nominal | 14pF/ft nominal | |||||
| Time delay | 1.31ns/ft nominal, (4.3ns/m) nominal |
1.35ns/ft nominal | 1.35ns/ft nominal | 1.35ns/ft nominal, (4.3ns/m) nominal |
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| Time delay skew (within pairs) |
80ps/10m maximum |
120ps/8.5m maximum |
120ps/7m maximum | 50ps/5.5m maximum |
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| Time delay skew (between pairs) |
350ps/10m maximum |
500ps/8.5m maximum |
500ps/7m maximum | 350ps/5.5m maximum |
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| Attenuation | 10dB/10m maximum @ 1.25Ghz |
10dB/8.5m maximum @ 1.25Ghz |
10dB/7m maximum @ 1.25Ghz |
8.4dB/5.5m maximum @ 1.25Ghz |
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| Physical Characteristics |
Conductor DC Resistance |
0.026Ω/ft maximum @20℃ |
0.04Ω/ft maximum @20℃ |
0.06Ω/ft maximum @20℃ |
0.01Ω/ft maximum @20℃ |
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| Conductors (two pair) |
24AWG Solid, Silver plated copper | 26AWG Solid, Silver plated copper | 28AWG Solid, Silver plated copper | 30AWG Solid,Silver plated copper | |||||
| Insulation | Foam polyolefin | Foam polyolefin | Foam polyolefin | Foam polyolefin | |||||
| Pair drain wire | 26AWG Solid, Silver plated copper |
28AWG Solid, Silver plated copper |
30AWG Solid, Silver plated copper |
30AWG Solid, Silver plated copper |
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| Overall cable shield | Aluminum/polyester tape, 125% coverage, Tin plated copper braid, 38AWG, 85% coverage |
Aluminum/polyester tape, 125% coverage, Tin plated copper braid, 38AWG, 85% coverage |
Aluminum/polyester tape, 125% coverage, Tin plated copper braid, 38AWG, 85% coverage |
Aluminum/polyest er tape, 125% coverage, Tin plated copper braid, 38AWG, 85% coverage |
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| Outer diameter | 6.0mm | 5.2mm | 4.7mm | 4.2mm | |||||
Pin Designation
| PIN | Logic | Symbol | Name/Description | Notes | |||||
| 1 | – | GND | Ground | 1 | |||||
| 2 | CML-I | Tx2n | Transmitter Inverted Data Input | – | |||||
| 3 | CML-I | Tx2p | Transmitter Non-inverted Data Input | – | |||||
| 4 | – | GND | Ground | 1 | |||||
| 5 | CML-I | Tx4n | Transmitter Inverted Data Input | – | |||||
| 6 | CML-I | Tx4p | Transmitter Non-inverted Data Input | – | |||||
| 7 | – | GND | Ground | 1 | |||||
| 8 | LVTTL-I | ModSelL | Module Select | – | |||||
| 9 | LVTTL-I | ResetL | Module Reset | – | |||||
| 10 | – | Vcc Rx | +3.3V Power Supply Receiver | – | |||||
| 11 | LVCMOS-I/O | SCL | 2-Wire Serial Interface Clock | 2 | |||||
| 12 | LVCMOS-I/O | SDA | 2-Wire Serial Interface Data | 2 | |||||
| 13 | – | GND | Ground | 1 | |||||
| 14 | CML-O | Rx3p | Receiver Non-Inverted Data Output | – | |||||
| 15 | CML-O | Rx3n | Receiver Inverted Data Output | – | |||||
| 16 | – | GND | Ground | 1 | |||||
| 17 | CML-O | Rx1p | Receiver Non-Inverted Data Output | – | |||||
| 18 | CML-O | Rx1n | Receiver Inverted Data Output | – | |||||
| 19 | – | GND | Ground | 1 | |||||
| 20 | – | GND | Ground | 1 | |||||
| 21 | CML-O | Rx2n | Receiver Inverted Data Output | – | |||||
| 22 | CML-O | Rx2p | Receiver Non-Inverted Data Output | – | |||||
| 23 | CML-O | Rx2n | Receiver Inverted Data Output | – | |||||
| 24 | CML-O | Rx2p | Receiver Non-Inverted Data Output | – | |||||
| 25 | – | GND | Ground | 1 | |||||
| 26 | CML-O | Rx4n | Receiver Inverted Data Output | – | |||||
| 27 | CML-O | Rx4p | Receiver Non-Inverted Data Output | – | |||||
| 28 | – | GND | Ground | 1 | |||||
| 29 | LVTTL-O | ModPrsL | Module Present | 2 | |||||
| 30 | LVTTL-O | IntL | Interrupt | 2 | |||||
| 31 | – | Vcc Tx | +3.3V Power Supply Transmitter | – | |||||
| 32 | – | Vcc1 | +3.3V Power Supply | – | |||||
| 33 | LVTTL-I | LPMode | Low Power Mode | – | |||||
| 34 | – | GND | Ground | 1 | |||||
| 35 | CML-I | Tx3p | Transmitter Non-inverted Data Input | – | |||||
| 36 | CML-I | Tx3n | Transmitter Inverted Data Input | ||||||
| 37 | – | GND | Ground | 1 | |||||
| 38 | CML-I | Tx1p | Transmitter Non-inverted Data Input | – | |||||
| 39 | CML-I | Tx1n | Transmitter Inverted Data Input | – | |||||
| 40 | – | GND | Ground | 1 | |||||
| Notes: 1. Module ground pins GND are isolated from the module case and chassis ground within the module. 2. Shall be pulled up with 4.7K-10Kohms to a voltage between 3.14V and 3.47V on the host board. |
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PRODUCT CERTIFICATION
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CONFIGURATION INFORMATION
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Switch to Switch
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